Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 ...
At CES, Intel details its launch lineup for the new Core Ultra Series 3 processors (based on its 2nm 18A architecture) that will launch this month across midrange to high-end AI PC laptops. I have ...
Intel will formally launch its first Core Ultra Series 3 laptop processors later this month, the company announced at its CES keynote today. Codenamed Panther Lake and targeted, at least for now, at ...
Intel has finally taken the last wraps off its Panther Lake-based Core Ultra Series 3 range of mobile chips, and it's making some pretty impressive claims about their performance. Before the expected ...
Vikram Solar Ltd today announced the adoption of G12R format across its entire PV module portfolio. The company said the move reflects broader industry trends toward larger-format wafers, ...
Intel’s Core Ultra 3 chips arrive January 27th. Intel’s Core Ultra 3 chips arrive January 27th. is a senior editor and founding member of The Verge who covers gadgets, games, and toys. He spent 15 ...
An international research team has developed a new two-dimensional perovskite interlayer based on a co-crystal engineering strategy for more robust perovskite films. It demonstrated improved ...
We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, and when a new one comes out we’ve got a pretty good idea what to expect.
Intel’s Core Ultra Series 3 chips, aka “Panther Lake,” have entered the market, backed by dozens of PC makers. “We’ve beeen out there shaping what it means for fundamental computing, said Jim Johnson, ...
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