Abstract: Laser rework (LR) and hot air rework (HR) process impact on the nearby ball grid array (BGA) rework components with lead-free solder Sn3.0Ag0.5Cu (SAC305) solder joints were investigated in ...
Abstract: Cu-fill extendability is demonstrated with a novel integration scheme using clustered ALD barrier, CVD Ru liner and PVD Cu dry-fill processes.
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