Abstract: This paper describes the three-dimensional structure of a single-sided cooling power module that uses a lead frame as a heat conduction path to cool power semiconductor dies on both sides.
Abstract: In this study, the thermal characteristics and structure reliability during power cycling for the four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum ...
We introduce VeriStruct, a novel framework that extends AI-assisted automated verification from single functions to more complex data structure modules in Verus. VeriStruct employs a planner module to ...
The Centre on Friday opposed the Delhi High Court’s intervention in a PIL seeking GST reduction on air purifiers from 18% to 5% by classifying them as medical devices, warning that any judicial ...
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