Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

According to news reports, Samsung and TSMC are expected to enter 5nm process mass production in 2020. The competition in 5nm wafer yield and market share will be very intense. A brand new wafer ...

Onto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) (“Onto Innovation,” “Onto,” or the “Company”) today announced its first shipment of the Company’s Dragonfly ® G3 system with the ...

MILPITAS, Calif., Dec. 10, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system.

Using non-destructive imaging methods, a team of scientists has obtained three-dimensional insights into the interior of crystals. They determine important data about line-shaped defects that largely ...

Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are ...

The use of design-based care areas on inspection tools [1, 2] to characterize defects has been well established in recent years. However, the implementation has generally been limited to specific ...

MILPITAS, Calif., July 8, 2019 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the 392x and 295x optical defect inspection systems and the eDR7380™ e-beam defect review system. The new ...

Following its acquisition of Candela Instruments, KLA-Tencor (www.kla-tencor.com) has introduced the Candela CS20, an automated wafer inspection system designed to address the defect management ...

As semiconductor manufacturers aim to produce devices at the 5-nanometer node, the ability to find tiny defects created inadvertently during the fabrication process becomes harder. In addition, there ...

Despite silicon carbide’s (SiC) promise over conventional silicon for the design of next-generation power electronics devices, broad adoption of this high-performance compound semiconductor has been ...