Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

Parallel piezo aligners with fly height sensors enable faster PIC wafer testing.

This video shows PI’s fast multichannel photonic alignment for silicon photonics. PI is able to offer precise solutions for fiber alignment from its range of precision positioning systems, keeping ...

A technique which will allow silicon wafers to be stacked accurately and inexpensively in 3-D structures has been developed by researchers at the University of Southampton. According to Dr Michael ...

PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. PI’s F-713 6-axis ...

With a focus on parallel optimization and nanoscale accuracy, precision positioning specialist PI is streamlining the optical alignment, test and packaging of quantum photonic devices Parallel lines: ...

When it comes to the fiber optic data highway, silicon photonics (SiP) sets the pace. Data rates in the TBit/s range can benefit rapid Internet access, cloud computing, big data, server farms, and an ...

ST. FLORIAN, Austria, July 6 /PRNewswire/ — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that ...

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...

The industry’s unquenchable thirst for I/O density and faster connections between chips, particularly logic and cache memory, is transforming system designs to include 3D architectures, and hybrid ...