The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

Rich in minerals and naturally heated by geothermal energy, the waters of this iconic spa are prized for their healing properties. Here’s how to experience them for yourself.

State CIO Kristin Darby describes the search for an agentic, auditable enterprise resource planning system, and why 2026 marks a shift from incremental upgrades to exponential change across state ...

Flair and Bliss had a silly exchange that felt like a waste of 90 seconds. They each teased going after each other before ...

Digimon has introduced over 1400 creative creatures, yet some fascinating Digimon have slipped through the cracks and been forgotten.

Iceland, having sat up there on the edge of the Arctic Circle almost unnoticed for centuries, is having a moment. There are around 370,000 Icelanders scattered across the blisteringly beautiful, other ...

At the recent World Economic Forum in Davos, India's IT Minister outlined the country's efforts to boost its semiconductor industry, highlighting the emergence of 24 Indian IC design... Wednesday 21 ...

The post Galaxy S27 Ultra Could Offer Face ID-Level Security Without the Large Cutout appeared first on Android Headlines.

As Nvidia's Jensen Huang arrived in Taipei, Taiwan's leadership moved to cement the island's position at the heart of the AI ...

The NFL is challenging innovators to improve the facemask on football helmets to reduce concussions in the game.

Bringing a modern PCB design together into reality is often the real test. The third part of this series offers practical ...