The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

GSI Technology, Inc. (Nasdaq: GSIT), the inventor of the Associative Processing Unit (APU), a paradigm shift in artificial intelligence (AI) and high-performance ...

ROHM extended the library of EROM-format models for its shunt resistors targeting automotive and industrial systems.

A major challenge in thermal-management and thermal-insulation technologies, across multiple industries, is the lack of ...

We've been working closely with ekwb since the first part of our series on the Delid & Direct Die Cooling project. This isn't the final update as we are still in the early prototype stage, but James ...

Taiwan Semiconductor remains a key component of the AI-led demand for advanced processors. Read more on how the company is supporting the AI supercycle.

The increasing power density in advanced WBG semiconductors necessitates the optimization of thermal management. The increasing power density in advanced wide-bandgap (WBG) and ultra-wide-bandgap ...

Getting AI governance right is one of the most consequential challenges of our time, calling for mutual learning based on the lessons and good practices emerging from the different jurisdictions ...

Abstract: To achieve net-zero carbon emissions, electrified and hybrid propulsion systems in air-transport increasingly demand high torque density motors. High torque density is invariably accompanied ...

Abstract: This paper investigates the surge reliability of commercial 1200V SiC MOSFETs through a combined approach of experimental testing and multiphysics simulation, elucidating the failure ...