Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave ...

Several major technology shifts are occurring in the mature ceramic capacitor market. Some of these shifts involve changes in materials; others involve changes in packaging. To cope with escalating ...

The performance of a radio-frequency integrated circuit can be dramatically affected by the package environment, yet packaging technology has received comparatively little attention compared with IC ...

The IC packaging design tool set has matured to the point where it can address not only classic plastic, organic and ceramic packaging substrates but can also address silicon substrates driven by ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...