Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the recent AI trend. Save ...
Japanese startup Elephantech is pioneering an innovative manufacturing technology that could significantly reduce the environmental impact of producing Printed Circuit Boards (PCBs). If successful, ...
Dublin, May 15, 2025 (GLOBE NEWSWIRE) -- The "Global Advanced IC Substrate Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The global advanced IC substrate market is ...
SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...
Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...
As demand for artificial intelligence (AI) chips soars, volumes of server substrates are increasing, but the mood in Korea's printed circuit board (PCB) industry is muted. Even with high factory ...
Designed for AI accelerators, high-speed data center servers, and optical transceivers, PCBAIR's 8-layer Glass Core PCBs support finer line widths and spacing, with pilot production and customer ...
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