As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

MINNEAPOLIS--(BUSINESS WIRE)--Nordson Test & Inspection today announced that its SpinSAM Acoustic Microimaging (AMI) system has been honored with the prestigious 2024 Global Technology Award in the ...

MINNEAPOLIS--(BUSINESS WIRE)--Nordson Test & Inspection today announced that it has earned the Prime Award, which is the top honor, at the Step-by-Step Excellence Awards (SbSEA) for its groundbreaking ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

The areas of semiconductor test, inspection, and related technologies have seen considerable innovation during the second half of 2017. With regard to test, traditional ATE companies introducing new ...