EDN

Test socket fits CSP, BGA, and LGA

The patented CSP/BallNest Hybrid Socket enables prototyping, test, or burn-in of CSP, BGA, microBGA, and LGA devices. The socket features a lid that nests each ball termination for connection ...
EDN

CSP, BGA underfill endures temp cycling

Designed to help secure CSP and BGA devices used in handhelds, CN-1531 underfill encapsulant has a 110°C glass transition temperature, allowing it to better withstand thermal cycling. The encapsulant ...
Electronic Design

Test Sockets Accommodate Fine Pitch CSP And BGA Devices

Designed for high frequency CSP and BGA devices with pitches from 0.5 mm through 1.27 mm, these RF test sockets employ a spring probe contact that ensures more than 500,000 insertion/withdrawal cycles ...
Electronic Design

BGA/CSP Socket Supports AMD 16-038

Users of the SG-BGA-6099 are said to be able to socket their 1-mm pitch, 829-ball BGA and CSP devices without any performance losses. As an example, the socket will support the AMD 16-038 chip with an ...