Wafer level and chiplets packaging required capillary underfill having much lower CTE and capillary gap-filling than those used in BGA board level packaging. UF-MC7883-FP introduced by AIT has been ...
Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results.
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, ...
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