Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The higher the number of wafer breakages, the slower the time to market. Given the ...
Two questions asked in this paper were: is the measurement by 4D InSpec equivalent on the original surface in respect to a replica, that is, how similar are the results? And: under what circumstances ...
Premature finishing, overworking the surface and inadequate curing are typical causes of surface defects on exterior slabs. Some of these defects include premature wear, scaling, mortar flaking and ...
A collaborative team led by Prof. Yi Xiong from Wuhan Textile University, Prof. Wei Zeng from Anhui University, and Prof. Shuo Jin from the Institute of High Energy Physics, Chinese Academy of ...
Onto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) ...
SpectX, TNO, and partners GE Vernova and LM Wind Power, will start a 2-years project to detect sub-surface defects in wind turbine blades by drone X-ray inspection. The findings will be integrated ...
As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...
Following the basic finishing rules will help you avoid blisters and delaminations, dusting, crazing, crusting and reduced resistance to surface wear on interior, steel troweled floors. Building ...
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