Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...

A team led by researchers at Rensselaer Polytechnic Institute (RPI) has made a breakthrough in semiconductor development that could reshape the way we produce computer chips, optoelectronics and ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

To continue reading this content, please enable JavaScript in your browser settings and refresh this page. Preview this article 1 min A mysterious company called ...

BANGALORE, India, Dec. 17, 2025 /PRNewswire/ --Semiconductor Advanced Substrate Market Size The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is ...