Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has ...
Researchers have now developed a new superior hardware platform for artificial intelligence accelerators using photonic integrated circuits on silicon chip. Co-packaged optics (CPO) technology can ...
A technical paper titled “Low-Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by researchers at imec and Ghent University. “Co-Packaged ...
The MarketWatch News Department was not involved in the creation of this content. Researchers discover that glass-epoxy-based waveguides have characteristics ideal for transmitting optical signals in ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback