ACM Research Introduces New Post-CMP Cleaning Tool for Silicon and SiC Wafer Substrate Manufacturing
FREMONT, Calif., July 12, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW ...
SEOUL — At the Sedex Korea 2005 trade show here, South Korean semiconductor-equipment provider Doosan DND Co. Ltd. rolled out an advanced chemical mechanical polishing (CMP) machine for 300-mm ...
ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...
CAMPBELL, Calif.--(BUSINESS WIRE)--Vantage Technology today announced it has formally qualified its SlurryScope™ System at major IC production fabs, underscoring its capabilities to continuously ...
Delray Beach, FL, June 05, 2025 (GLOBE NEWSWIRE) -- The report "Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP ...
At the semicon west semiconductor equipment and materials trade show in San Francisco last month, competing announcements spelled potential trouble for companies in the fast-growing business of ...
Suppliers of chemical mechanical planarization (CMP) slurries may be fierce competitors of Cabot Microelectronics, the company considered to be the sector's number one player, but they agree with the ...
FREMONT, Calif., Sept. 23, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
San Francisco – Semiconductor manufacturing on 300-mm wafers still faces several major challenges before the larger substrates are able to deliver the expected 30 percent die-cost savings compared ...
The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...
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