EAGAN, MN – December, 2013 – Ironwood Electronics has recently introduced a new high performanceSOIC socket for 0.5mm pitch 10 pin SOIC. The SG-SOIC-3005 socket is designed for 3mm x 3mm x 1mmpackage ...
TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existing ...
PITTSBURGH, April 24, 2019 /PRNewswire/ -- TSMC certified ANSYS (NASDAQ: ANSS) solutions for its innovative System-on-Integrated-Chips (TSMC-SoIC™) advanced 3D chip stacking technology. SoIC is an ...
TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...
Infineon is shipping a 200V half-bridge gate driver IC in a standard SOIC-8 (DSO-8) package. It is a new member of the EiceDRIVER 200 V level-shift gate driver family. Featuring undervoltage-lockout ...
TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization of ...
HSINCHU, Taiwan--(BUSINESS WIRE)--TSMC (TSE: 2330, NYSE: TSM) today announced the Open Innovation Platform ® (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC ...
The news is coming from Taiwanese media outlet Ctee, reporting that the Chiayi Science Park was finalized this year and is expected to build two advanced packaging plants first. The first phase of ...
New galvanically isolated CAN FD transceivers from ADI and TI meet and exceed the spec’s requirements for speed, working voltage, breakdown voltage, EMI emissions, and other key parameters. The ...
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