The US Patent and Trademark Office (USPTO) has granted a patent to Michael Molinelli of Molinelli Architects and Ashok ...

System-in-package (SiP) technology is at the beginning of its revolution. Some see the SiP in the same way as a system on chip (SoC)—as an IC component with no simple path to further customization.

Today, we dove into the world of SIP Systems and the game-changing benefits they bring to the construction industry. As an Oahu-based wholesaler and service provider for Structural Insulated Panels ...

1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

A technical paper titled “Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies” was published by researchers at UCSB, University of California, Santa Barbara.