IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Universal Scientific Industrial (Shanghai) Co., Ltd., (SSE 601231), a leading global company in electronic design and manufacturing, is going to launch WM-BAC-CYW-33 SiP (System in Package) module for ...

PARIS--(BUSINESS WIRE)--Sequans Communications S.A. (NYSE: SQNS), leading provider of LTE for IoT chips and modules, announced that its Monarch SiP (system-in-package) and Monarch GM01Q module, have ...

System-on-chip (SoC) and system-in-package (SiP) solutions offer benefits in terms of component count and complexity. Thus, it’s important for designers to understand the pros and cons of each when ...

The world's first SiP (System in Package) processed LoRa+MCU solution is presented today through the extraordinary collaboration between the world-leading Internet of Things solution providers Gemtek ...

Insight SiP, a specialist in ultra-miniature RF modules, has introduced the ISP3010 RF module, which combines smart Ultra-Wide Band (UWB) and Bluetooth Low Energy (BLE) capabilities with a MCU ...

(MENAFN- EIN Presswire) HoduSoft one of the leading Voice over Internet Protocol (VoIP) solution providers globally, has announced the SIP Trunking module in HoduPBX. AHMEDABAD, GUJARAT, INDIA, April ...

By using advanced "3D stacking" technology, Izmo re-engineered a standard 200mm x 200mm electronics board into a compact 81mm ...

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

Silicon Labs has introduced what it claims in the smallest Bluetooth low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete connectivity solution. The BGM12x Blue ...