The SiC-based power electronics market is experiencing robust growth, driven by rising demand in electric vehicles, renewable energy systems, and industrial automation. Silicon carbide (SiC) ...

General Motors announced a strategic supplier agreement with Wolfspeed (previously Cree), concerning long-term supplies of silicon carbide (SiC) power device solutions. GM intends to shift to more ...

There remains little doubt that silicon carbide, a so-called third-generation, wide-bandgap semiconductor is fulfilling its long-known potential, with the automotive industry having been the very ...

ALBANY, N.Y., Sept. 8, 2025 /PRNewswire/ --NoMIS Power Corporation, a leader in advanced Silicon Carbide (SiC) power semiconductor technology, today announced the commercial release of its first 3.3 ...

By traditional metrics, NVTS stock looks expensive. The company has very low current revenue and is not yet profitable. Yet its market cap is around $2.5B. This yields eye-popping valuation ratios.

PITTSBURGH and TOKYO, May 26, 2023 (GLOBE NEWSWIRE) -- Coherent Corp. (NYSE: COHR), a global leader in materials, networking, and lasers, and Mitsubishi Electric Corporation (TOKYO: 6503) today ...

SemiQ’s SOT-227 SiC power modules, which are tested beyond 1,400 V, target battery chargers, photovoltaic inverters, server ...

STMicroelectronics has revealed an advanced new product family enabling power supply designers to drive up energy efficiency in applications such as solar inverters and electric vehicles, enterprise ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will enter into a strategic partnership with Nexperia B.V. to jointly develop silicon carbide (SiC) power ...

Mitsubishi Electric will exhibit the new trench SiC-MOSFET bare dies at the 40th Nepcon Japan R&D and Manufacturing show in Tokyo from January 21 to 23, as well as exhibitions in North America, Europe ...

TORRANCE, Calif., Oct. 31, 2024 (GLOBE NEWSWIRE) -- Navitas Semiconductor (NVTS) (Nasdaq: NVTS), the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC ...

A new technical paper titled “Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging” was published by researchers at ...