Reducing the parasitic capacitance between the gate metal and the source/drain contact of a transistor can decrease device switching delays. One way to reduce parasitic capacitance is to reduce the ...

Integrated circuit (IC) designers move to advanced process technology nodes to leverage higher performance, density, and functionality, as well as reduced delay and power consumption, enabled by ...

As the Semiconductor industry is growing so does the density of devices on chip. With the increasing density and decreasing spacing rules, the most significant effect that takes birth is parasitic.

Leakage current has been a leading cause of device failure in DRAM design, starting with the 20nm technology node. Problems with leakage current in DRAM design can lead to reliability issues, even ...

Communication systems often require large ac output coupling to remove dc voltage on the transmission line and to isolate ground connections between transmit and receive systems. Generally, a feedback ...