ELIS Manufacturing and Packaging Solutions Inc. announced continued investment in and refinement of its stick pack manufacturing and packaging capabilities, reinforcing the company’s role in ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

FREUDENSTADT, Germany, Nov. 10, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (SHMD), a global equipment maker and solution provider for Printed Circuit Boards (PCB) and IC-Substrate manufacturing, today ...