In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

SPHBM4 cuts pin counts dramatically while preserving hyperscale-class bandwidth performanceOrganic substrates reduce packaging costs and relax routing constraints in HBM designsSerialization shifts ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

TSMC certifies CoWoS® and InFO design flows based on the Synopsys 3DIC Compiler unified platform 3DIC Compiler accelerates advanced packaging design productivity Integrated with Ansys' chip-package co ...

As high-speed data access, transmission, and storage move from high-end computing and long-haul SONET (synchronous-optical-network) applications into portable computing and Ethernet LANs (local-area ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

Antenna packaging methodologies have evolved significantly to counter the escalating signal attenuation in high-frequency communications like 5G mmWave and anticipated 6G networks. Benchmark of ...