Dutch researcher Michiel Blauw has described the physical limitations of the plasma-etching of deep, narrow microstructures in silicon. His results have led to such an improvement in the etching ...
SANTA CLARA, Calif.–Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries ...
After years in R&D, a technology called cryogenic etch is re-emerging as a possible option for production as the industry faces new challenges in memory and logic. Cryogenic etch removes materials in ...
As part of LASER COMPONENTS‘ presentation marathon at the SPIE LASER conference during Photonics West, Thierno-Mamoudou Diallo, Opto-Electronics and III-V Semiconductor Specialist at LASER COMPONENTS ...
Demand for high power devices is increasing in several electronics applications, including automotive, industrial, data center, and energy industries. Today, power devices have to meet stringent ...
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