EurekAlert!

Etching of deep trenches in silicon explained

Dutch researcher Michiel Blauw has described the physical limitations of the plasma-etching of deep, narrow microstructures in silicon. His results have led to such an improvement in the etching ...
EDN

Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes

SANTA CLARA, Calif.–Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries ...
Semiconductor Engineering

A Deposition And Etch Technique To Lower Resistance Of Semiconductor Metal Lines

Copper’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of copper (Cu) ...
Optics

Deep ICP-RIE Etched Trenches with Sidewall Slope Control of GaAs-type High Power PLDs

As part of LASER COMPONENTS‘ presentation marathon at the SPIE LASER conference during Photonics West, Thierno-Mamoudou Diallo, Opto-Electronics and III-V Semiconductor Specialist at LASER COMPONENTS ...
EDN

Deep Silicon Etch Technology Enables Next Generation Power Devices

Demand for high power devices is increasing in several electronics applications, including automotive, industrial, data center, and energy industries. Today, power devices have to meet stringent ...