EDN

Samsung introduces LED components based on chip-scale packaging technology

Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...

Polar Light Technologies achieves nano-scale LED; paves way to next-generation MicroLED / NanoLED devices

Polar Light Technologies AB ("Polar Light"), a Swedish semiconductor innovator specializing in next-generation MicroLED technology, today unveiled a breakthrough at SPIE Photonics West 2026, ...
Business Wire

Samsung Introduces New Line-up of LED Components for Automotive Lighting, Featuring Chip-Scale Packaging

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, announced today that it has introduced “Fx-CSP,” a line-up of LED packages which ...
EDN

For Increased Brightness in LEDs, Shin-Etsu MicroSi Silicone Encapsulant Packaging Materials

For the high-end blue and white light LED market, Shin-Etsu MicroSi packaging materials don’t yellow with age and dissipate heat more quickly, producing LEDs that are more efficient, more reliable and ...
Electronic Design

Interconnections & Packaging: White LED Light Guides For 3G Cell Phones Up Backlighting Efficiency

The MicroLens family of molded white LED light guides provides bright, efficient, and cost-effective backlighting for 3G cell phones. These guides feature enhanced brightness (up to 10,000 nits), ...