Harvatek Corporation has introduced a new LED product in chip scale package (CSP). This LED has high brightness with low power dissipation and there are no wire bonding which reduces the processing ...
Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in solder paste printing. Through technological innovation, Fitech enables its ...
Owing to improvements in LED chip and package technology, Osram’s Ostar Projection Power series achieves brightness levels exceeding 3000 ANSI lumens. Developers at Osram fundamentally modified the ...
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