If the motherboard's manufacturer finds it necessary to attach a heat sink to the top of a TO-263 package, then they are a) not using a large enough thermal plane for the MOSFET, and b) using the ...
Santa Clara, Calif. – Vishay Siliconix' new “SUR”-packaged TrenchFET power MOSFETs are in a reverse-lead TO-252 DPAK package to allow the devices to be mounted inversely on the printed circuit board ...
Compared to traditional silicon, power MOSFETs based on silicon carbide (SiC) can handle higher voltages with lower on-resistance (R DS(on)) and superior thermal conductivity, opening the door to ...
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