Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

As device sizes continue to increase on devices at 2x nm design rule and beyond and high wafer stress is worsening due to multi-film stacking in the vertical memory process, we observe an increasing ...

Semiconductor process engineers have always understood the need to inspect silicon wafers to identify defects and eliminate them at their source. To simplify the process, semiconductor equipment ...