Where does advanced packaging stand in 2017? Is it nearing an inflection point? The semiconductor industry is steadily running out of transistor scaling options, so the spotlight is inevitably turning ...
“The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the ...
The AI chip market holds tremendous potential - breakthroughs in FOPLP technology to overcome the RDL-first process barrier will be the key to success. Abstract DIGITIMES observes that fan-out ...
An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...
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