DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/8hkb2l/atands_ecp) has announced the addition of the "AT&S ECP® Embedded ...

The "Global Embedded Die Packaging Technology Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast, 2017 - 2023" report has been added to Research and Markets' offering.

Rohm and TDK-EPC have joined forces to provide an alternative solution for embedded die technology. This SiP module is a second-source supply of the Texas Instruments MicroSiP DC/DC Converter.

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive electronic ...

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

Intel is unveiling packaging innovations for creating three-dimensional chip packages and other solutions that put together multiple chips. In advance of the Semicon West conference in San Francisco, ...