SAN JOSE, Calif. — For next-generation memory production, 193-nm lithography with self-aligned double-patterning (SADP) are the technology of choices over rival schemes, according to an analyst.
TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...
During the Sematech Litho Forum held last week in Bolton Landing, NY, semiconductor manufacturers, equipment suppliers and researchers gathered to evaluate the progress of the various technology ...
As the optical lithography advances into the sub-30nm technology node, the various candidates of lithography have been discussed. Double dipole lithography (DDL) has been a primary lithography ...
If double patterning gets established is it just a stop gap until EUV ? This was the entertaining subject at coffee with my editor at semimd (the great thing about writing a free blog is that you get ...
The disclosure is further evidence that 193-nm immersion — with some form of a double-patterning technique — can scale much further than previously thought. It also means that extreme ultraviolet (EUV ...
BELMONT, Calif.--(BUSINESS WIRE)--Nikon Corporation has announced they will provide an immersion scanner for Double Patterning, based on the successful NSR-S610C platform, to their customers in the ...
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