Infineon Technologies AG introduced automotive qualified 100 percent lead-free power MOSFETs for TO package types. Infineon Technologies AG introduced automotive qualified 100 percent lead-free power ...
Fundamental materials properties of the plated layer (such as purity and microstructure) are critical for die attach and wirebond, and the specific plating strategies that can yield these properties.
Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...
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