The IC packaging design tool set has matured to the point where it can address not only classic plastic, organic and ceramic packaging substrates but can also address silicon substrates driven by ...
SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its newest molded ceramic ...
SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave ...
IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...
Where ceramic packaging and substrates are employed. Why designing solutions with ceramic packaging and substrates is challenging. Ceramic packaging and substrates address high-performance and ...
RF power requirements for commercial wireless applications have evolved dramatically over the past few decades. Today, basestation manufacturers demand power ICs capable of offering higher linearity ...
The performance of a radio-frequency integrated circuit can be dramatically affected by the package environment, yet packaging technology has received comparatively little attention compared with IC ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback