Flip-and-Lap in the fab moves image array to front of imager, which yields sharper, more sensitive pixels, but wafer bonding step adds cost. Tessera Technologies reports a conflict (and resolution) ...
STMicrolectronics and Soitec announced an exclusive joint cooperation to develop 300-mm wafer-level BSI (backside-illumination) technology for the next-generation of image sensors in consumer ...
Mobile OLED screen, captured by the GMAX15271BSI evaluation system. Application of GMAX15271BSI GMAX15271BSI a groundbreaking CMOS image sensor designed to push the boundaries of industrial and ...
DUBLIN--(BUSINESS WIRE)--The "CMOS Image Sensor Market By Technology (Front side-illuminated (FSI) CMOS Image Sensor and Backside-illuminated (BSI) CMOS Image Sensor), By Application, and By Region - ...
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