Austin, Tex. — A 0.8-mm pitch Type IV open top BGA test and burn-in socket family from 3M Electronic Solutions Division handles up to 961 leads. The 3M Textool brand test and burn-in socket line is ...
The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...
The patented CSP/BallNest Hybrid Socket enables prototyping, test, or burn-in of CSP, BGA, microBGA, and LGA devices. The socket features a lid that nests each ball termination for connection ...
The company's BGA and mBGA Quick Lock Sockets rely on a unique cover design that promises both easy and swift access to the device without the need for tools to actuate or secure the lid. Once the ...
BGA socket adapter provide an inexpensive and reliable interconnect for attaching BGA chips to target board. These adapters have less than half of the insertion force of competitive adapters, shorter ...
Galileo is a test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to ...
Smiths Interconnect has created an IC test socket for high-speed testing of 350μm minimum pitch devices. Smiths Interconnect has created an IC test socket for high-speed testing of 350μm minimum pitch ...
Assuming position as one of the largest, full-pattern-capable, open-top sockets available, the 3M Textool brand Type IV, 0.8-mm, open-top BGA test and burn-in socket now accepts packages on a 0.8-mm ...
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